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Conference Proceeding Papers

Click on presentation title to download individual proceeding paper.

Adhesion to Difficult Substrates

UV-Curable Acrylate Resins for Difficult Substrates
Chakrapani Srinivasan, IGM Resins

Formulating strategies for adherence to difficult substrates
Christopher MacNeil, Sartomer Americas

Enabling energy curable adhesion through polymer design
William C. Miles, Penn Color, Inc.

High Performance UV-Cured Enamels for Metal Coatings
Paul Kelly, Luxsit Ltd – on behalf of Qualipoly Chemical Corp


Industrial Applications via Novel Compact Electron Beam Accelerator
Charlie Cooper, llinois Accelerator Research Center, Fermi National Accelerator Laboratory

Excimer – The Latest Advances
Robert Saenger, IST AMERICA

UV Lamp Selection – A Study in Packaging Applications
Mike J Idacavage, Radical Curing LLC

Aging behavior of AlGaN and SiC UV photodetectors
Tilman Weiss, sglux GmbH

Global Market Overview

North American Market Overview
Eileen Weber, allnex and President, RadTech North America

Europe Market Overview
Paul Kelly, RadTech Europe/Luxsit Ltd.

Hybrid / Dual Cure

Innovations in Dual Cure Technology
Chris Baumgart, Red Spot Paint and Varnish

Hybrid Radiation Curing – UV/LED & Excimer
Chris Davis, IST AMERICA

Comparison of UV and EB processing on Structure Property Relationships
Jon Scholte, Sartomer Americas

Investigation of UV/EB dual cure method to mitigate oxygen inhibition
Sage Schissel, PCT Ebeam and Integration, LLC

Printing & Packaging

Multi-functional dispersants for UV inks
Elliot Coulbeck, Lubrizol Ltd

Recyclable Packaging Options with Electron Beam Curing Technology
Imtiaz Rangwalla, Energy Sciences Inc.

Food packaging compliant inks and set-off migration
Julie Cross, Domino Printing Sciences

Attainable Sustainable: Using Electron Beam Technology in Compostable Flexible Packaging
Karl Swanson and Sage Schissel, PCT Ebeam and Integration, LLC

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