Conference Program

Short Courses
Monday, March 9
Tuesday, March 10
Wednesday, March 11
IUVA Conference

Wednesday, March 11, 2020

TRACK A

Electronics

8:00 AM – 10:00 AM

Mechanical Endurance Testing for UV/EB Components in Flexible Electronics
Eisuke Tsuyuzaki, Endurance Testing Systems
Development of photosensitive dielectric material with high resolution and reliability
Hwa-il Jin, Samsung Electronics
Dielectric Performance for Electronic Applications using UV-Curable Chemistries
Neal T. Pfeiffenberger, Sartomer
Use of High Refractive Index Materials in Display and Optical Devices
Selina Monickam, Pixelligent Technologies, LLC

TRACK B

Equipment

8:00 AM – 10:00 AM

Industrial Applications via Novel Compact Electron Beam Accelerator
Charlie Cooper, llinois Accelerator Research Center, Fermi National Accelerator Laboratory
Excimer - The Latest Advances
Robert Saenger, IST AMERICA
UV Lamp Selection - A Study in Packaging Applications
Mike J Idacavage, Radical Curing LLC
Aging behavior of AlGaN and SiC UV photodetectors
Tilman Weiss, sglux GmbH

TRACK C

Sustainability & Regulatory

8:00 AM – 10:00 AM

Regulatory Landscape for UV/EB Printing Inks in Europe
Brigitte Lindner, RAHN USA Corp.
Moving Forward: A look at how the regulatory climate impacts change
Marcia Kinter, SGIA
Regulatory Development for UV/EB from the West Coast
Rita Loof, RadTech
Responsible Care Considerations for Sustainable Development in Radiation Cure Markets
Vivien Clayton, Sartomer Americas

Break + Exhibits

10:00 AM – 10:15 AM

TRACK A

Photoinitiators

10:15 AM – 12:15 PM

Quantum PIs, novel materials for water-based and solvent-free polymerization
Nir Waiskopf, The Hebrew University of Jerusalem
Photoinitiator Effect on Depth of Cure in Visible Light Cure Polymerization
Shuhua Jin, Henkel Corporation
Photoinitiator selection to advance the UV curing industry in an uncertain world
Stephen R Postle, IGM Resins
Achieving Optimal Cure Speed of Acrylic Coatings Cured in Air using UV LED Arrays
Robin Wright, Wright Way UV Consulting

TRACK B

Adhesives

10:15 AM – 12:15 PM

Flexible Cyanoacrylate Adhesives
Ling Li, Henkel
Energy Curable Structural Adhesives
Jennifer McClung, allnex
UV - VIS initiated unlimited cure through cyanoacrylate adhesive
Shabbir Attarwala, Henkel Corp
Effect of Oligomer Structure on the Properties of UV Adhesives
Willy Du, Wraio Chemicals

TRACK C

New Product Debut III

(Open to All Attendees)

10:15 AM – 12:15 PM

LightHammer® MarkII/III Platform: Solid-state power for microwave systems
Kevin Joesel, Heraeus Noblelight America

Nippon Shokubai’s Functional Monomers
Aki Kanaya, Nippon Shokubai Co., Ltd.

High-performance units for the curing of inks, varnishes, adhesives and sealants
Deivis Parejo, Honle UV

Taking Mercury Out of UV Curing
Andrew Brannon, American Ultraviolet

Micro Remote Sensor Series for UV Disinfection Light Source Measurements
Jill Fowler, International Light Technologies, Inc.

Solsperse 87000: 100% active dispersant for difficult to disperse PR57.1
Jeff Norris, Lubrizol Advanced Materials

New highly efficient and odorless Type II photoinitiator without exhibiting any indication of mutagenic potential
Eric Zhou and Dr. Chen Liang, Changzhou Tronly New Electronic Materials Co.,Ltd

ELECTRON BEAM: HIGH SPEED SUSTAINABILITY
Brian Sullivan, Energy Sciences Inc.

Exhibit Theater

Defining Sustainability with UV & EB Technology
10:15am - 11:00am
IUVA Young Professionals Ask Me Anything (Presented by IUVA)
11:15am - 12:00pm

Lunch + Exhibits

12:15 PM – 1:15 PM

TRACK A

Global Market Overview

1:15 PM – 3:15 PM

North American Market Overview
Eileen Weber, allnex and President, RadTech North America

Europe Market Overview
Paul Kelly, RadTech Europe/Luxsit Ltd.

TRACK B

Kinetics

1:15 PM – 3:15 PM

Solvent-Free Radical Photopolymerization with Dark Curing
Kangmin Kim, University of Colorado Boulder
Real time measurement of cure in inkjet inks
Martin Thompson, Domino Printing
How monomer chemistry and radical formation impact EB polymer development
Sage Schissel, PCT Ebeam and Integration, LLC
Study of UV-Curing Behavior by Differential Scanning Calorimetry (DSC) and In-situ Dielectric Analysis (DEA)
Yanxi Zhang, NETZSCH INSTRUMENTS NORTH AMERICA, LLC

TRACK C

New Product Debut IV

(Open to All Attendees)

1:15 PM – 3:15 PM

Semray® 5000, 7000, 4103 & 6103 – High performance UV-LED systems
Kevin Joesel, Heraeus Noblelight America

Dual Energy Cure POSS Additives for Coatings
Joe Lichtenhan, Hybrid Plastics Inc

Trends and Future Outlook for UVA and UVC LEDs
Murali Kumar, Luminus Devices

UVMax® UV Curable Resin Provides New Coating Opportunities
Michael Knoblauch, Keyland Polymer Material Sciences, LLC

Waterborne-UV Resins, Fit for Use and Exterior Applications
Eileen Weber, allnex

Low Viscosity Aliphatic Urethane Hexa-acrylate Oligomer
Jerry Lu, Double Bond Chem. Ind., USA, Inc.

Register Now

6935 Wisconsin Ave. Ste 207 · Chevy Chase, MD 20815 
uveb@radtech.org · 240-497-1242 · 240-643-0517

Mechanical Endurance Testing for UV/EB Components in Flexible Electronics

Eisuke Tsuyuzaki, Endurance Testing Systems

New form factors in components and products are being introduced, including flexible hybrid electronics. Product examples are foldable displays, wearable sensors and smart IoT speakers with AI. Component examples are flexible displays, printed flexible electronics, and metal ink compounds. New material components will be needed for flexible electronics in wellness and medical products, and sportswear. New methods will be needed to design continuous and lasting mechanical performance into product designs and to test those new products.

Development of photosensitive dielectric material with high resolution and reliability

Hwa-il Jin, Samsung Electronics

Fan-out WLP is the technology that increases the number of interconnection by pulling the terminals out of the die. This technology enables wafer-level packages at a low cost even for high-performance chips. The insulating material that serves to protect Cu-line is known as playing the most important role in RDL process of Fan-out technology. In this paper, the properties of the newly designed photosensitive dielectric material with high resolution and reliability will be discussed.

Dielectric Performance for Electronic Applications using UV-Curable Chemistries

Neal T. Pfeiffenberger, Sartomer

UV-curable electronic materials require a unique set of expertise in resin formulation, processing, and end-use properties. Commercial uses for UV-curable electronic products include conformal coatings, potting, photoresists, display materials, adhesives, as well as various 3D printing applications. This paper will focus on using dielectric testing techniques to quantify a wide range of electronics resins for these growing applications.

Use of High Refractive Index Materials in Display and Optical Devices

Selina Monickam, Pixelligent Technologies, LLC

High refractive index materials with high optical clarity, and solution processability enable the next generation of display, lighting, and optical applications. Pixelligent’s PixClear® high refractive index ZrO2 and TiO2 nanocomposites features uniform particle size with controlled surface chemistry that delivers unmatched field of view and light outcoupling for display and optical devices, and meets the most demanding requirements of applications in AR/VR, OLED, Micro/MiniLED, 3D/CMOS sensors, and nanoimprint lithography. These nanocrystals are compatible with many polymer systems including acrylics, epoxies and silicones to increase the refractive index of the polymer. Applications of nanocomposites in these areas will be discussed.

Industrial Applications via Novel Compact Electron Beam Accelerator

Charlie Cooper, llinois Accelerator Research Center, Fermi National Accelerator Laboratory

Electron beams (e-beams) are an exceptional source of energy that can initiate chemical reactions without the need for catalysts, high temperature or high pressure. The high kinetic energy and penetrating nature of the electrons can provide significant benefits over typical chemical modification methods. E-beam accelerator sales eclipse $2B annually and provide added value to products of more than $500B every year (RW Hamm, Industrial Accelerators and Their Applications, 2012). However, adoption of e-beam technology in new areas has been relatively slow because of a general lack of knowledge of the technology. Also, conventional high energy e-beam accelerators that are available on the market have limitations in that they are not energy efficient, take up a large foot print and can be complicated to use and maintain. Fermilab, as a national leader in research and development of e-beam technology, is incorporating multiple new technologies into a novel platform e-beam accelerator that is decades more advanced than currently available technology. Concurrently, we are developing applications that would be enabled by this accelerator. Fermilab is using newly developed superconducting materials and radio frequency power supplies that can double the operating efficiency and greatly reduce the operating cost of using e-beam technology. In addition, Fermilab is using cryocoolers to cool the e-beam tool instead of flowing liquid helium which requires a cryoplant to operate. Because of these and several other advances, Fermilab aims to provide a portable accelerator that can fit on the bed of a truck, treat more product, and operate 30% more efficiently than conventional electron beam accelerators. The accelerator Fermilab is developing is pictured above. The left image represents the accelerator vacuum vessel in blue and its supporting components (a chiller, power supply and controls rack). The overall size of the skid shown is roughly 5 by 7 by 13 feet. The right image shows a cross-sectional view of the blue accelerating unit shown in the left image.

Excimer – The Latest Advances

Robert Saenger, IST AMERICA

The excimer platform (@172 nm) has been developed to include surface modification/treatment, post-curing of technical coatings and applying a matt effect.Excimer easily combines with LED and UV in one platform, to provide a hybrid solution to several industrial applications. This presentation will highlight the latest advances and addresses some of the application challenges

UV Lamp Selection – A Study in Packaging Applications

Mike J Idacavage, Radical Curing LLC

Many applications with existing equipment have limited space for the addition of UV lamps. Printing on flat metal sheets for the can industry is one such application. Printing presses have a tight space constraint in which to mount an inter-deck lamp and as a result, can limit UV lamp options. Microwave lamps are seldom used because they are simply too large. However, after the sheet is printed, UV lamps can be used to complete the curing at the end of the line. In this case, any lamp size or type could be used to complete the ink cure.

This paper will explore a comparison of lamp types used for inter-deck ink curing and final ink curing. In a broader sense, the experimental results presented will be applicable to a wide range of applications where there are options to choose between high powered arc lamp, microwave lamp, or UV-LED lamp systems.

Aging behavior of AlGaN and SiC UV photodetectors

Tilman Weiss, sglux GmbH

The detection of UV radiation can be done with different types of photodiodes. Main distinguishing feature of UV photodiodes is the radiation hardness and the semiconductor material, which can be either Silicon (Si), AlGaN or Silicon Carbide (SiC). Disadvantage of Si based photodiodes is the sensitivity to visible light. AlGaN and SiC based photodiodes are intrinsically visible blind. Moreover, AlGaN offers the opportunity to tune the absorption edge by varying the Al content thus enabling specialized UVA, UVB or UVC diodes without using filters. The present study informs about the degradation behavior of SiC and AlGaN photodiodes illuminated with different types of UV radiation up to 130mW/cm2 and up to 10.000 hours. The test were performed at room temperature, at 85°C and at 350°C. Before and after aging the samples had been characterized by measuring the spectral responsivity and the photoluminescence.

Regulatory Landscape for UV/EB Printing Inks in Europe

Brigitte Lindner, RAHN USA Corp.

Supplying UV/EB curable formulations from North America into other regions requires the North American based formulators to become familiar with the respective regulations for import and applications their products should be supplied into. The presentation will focus on the import into the European market regulated by EU REACH (Brexit?) and on requirements for printing inks used in food packaging applications. A short outlook on regulatory developments in other regions will be given as well.

Moving Forward: A look at how the regulatory climate impacts change

Marcia Kinter, SGIA

The adoption of changes to California’s Prop 65 program, US EPA’s new TSCA program as well as state regulatory initiatives are creating a landscape that is constantly changing. It is becoming more critical for chemical formulators to understand the drivers that are propelling the print industry to choose the inks used. This session explores how the current, and possibly future, regulatory framework is shaping the products both requested and used by the printing industry.

Regulatory Development for UV/EB from the West Coast

Rita Loof, RadTech

Responsible Care Considerations for Sustainable Development in Radiation Cure Markets

Vivien Clayton, Sartomer Americas

Quantum PIs, novel materials for water-based and solvent-free polymerization

Nir Waiskopf, The Hebrew University of Jerusalem

Quantum Photoinitiators (PIs), made of semiconductor nanocrystals, have been found as novel photoinitiators for water-based photo-curing applications, filling unmet needs and offering significant advantages over current PI technology. Herein, we will present the expansion of these unique capabilities also for solvent-free and additive-free photo-polymerization operating under modern UV-blue-LED light sources.

Photoinitiator Effect on Depth of Cure in Visible Light Cure Polymerization

Shuhua Jin, Henkel Corporation

The choice of photoinitiator (PI) is an important factor in the polymerization characteristics of light cure materials. This study investigated the influence of PI type and concentration on the surface tackiness and depth of cure (DOC) of experimental light cure acrylate formulations with several UV/visible photoinitiators. The chosen UV/visible photoinitiators include Type I PI phosphine oxide derivatives and Type II PI thioxanthone derivatives. Surface tackiness and DOC were also studied using two different radiation intensities emitted by LED 375nm and LED 405nm curing lights. The correlations of PI type and concentration with DOC help light cure material formulation to achieve a tack free surface and suitable depth of cure, which are important in many adhesive applications.

Photoinitiator selection to advance the UV curing industry in an uncertain world

Stephen R Postle, IGM Resins

The UV curing industry stands at the brink of a number of compliance and performance challenges. Photoinitiators including acyl phosphine oxides and alpha amino ketones are under activist regulatory threat. In this paper, we will present alternates to workhorse photoinitiators like TPO, novel photoinitiator blends offering dual cure options , acrylated photoinitiators for ultra-low migration, and patented acyl phosphine photoinitiators offering superior performance for sensitive packaging, ink jet, wood coatings and other sectors.

Achieving Optimal Cure Speed of Acrylic Coatings Cured in Air using UV LED Arrays

Robin Wright, Wright Way UV Consulting

While it has been shown that use of a 275 nm array in combination with a UVA array can dramatically improve the cure speed and surface properties of several commercial acrylic coatings cured in air compared to UVA alone, there have been no studies to evaluate the effect of different photoinitiators. We report here results comparing three common α-cleavage photoinitiators on the rate of conversion and relative surface cure of an abrasion resistant, free-radically polymerizable clear coat cured in air.

Flexible Cyanoacrylate Adhesives

Ling Li, Henkel

Light-curable cyanoacrylate (CA) adhesives are one-part adhesives which can be cure by both light exposure and surface moisture. Due to this unique dual-cure mechanism, these adhesives offer significant advantage over conventional CA and light-curable acrylic adhesives. However, these adhesives cure into brittle and rigid polymers, which limits their use for bonding soft or flexible parts. In this study, several approaches to improve flexibility of cyanoacrylate adhesives are reported, and flexible cyanoacrylate adhesives were successfully developed. Products based on this innovative technology provide improved flexibility while maintain all benefits of cyanoacrylate adhesives such as fast cure speed and shadow curing capability, providing a novel solution for the assembly of flexible medical devices.

Energy Curable Structural Adhesives

Jennifer McClung, allnex

Energy (UV) curable adhesives are single component adhesives that offer rapid cure response (bonds in seconds), high bond strength, and ease of application. UV adhesives offer unlimited pot life; they are not oxygen inhibited, have excellent resistance to a wide variety of chemicals such as fuels and solvents, and the strength to withstand some of the harshest environmental conditions. These are critical attributes for Original Equipment Manufacturing (OEM) and finishers who are consistently searching for lighter materials to improve fuel efficiency or more efficient ways to bond sensor and various parts of the vehicle body for todays or future concepts such as autonomous vehicles. Energy curable adhesives are also ideal for other applications such as structural electronics.

UV – VIS initiated unlimited cure through cyanoacrylate adhesive

Shabbir Attarwala, Henkel Corp

Cyanoacrylate (CA) monomer polymerize due to moisture and ionic cure mechanism to form an excellent adhesive bond strength on a wide variety of substrates. One of the main limitations of CAs is incomplete cure and significant decrease in adhesive properties as gap size is increased. UV curable CAs were developed using innovative UV initiator technology to overcome such limitations. These novel adhesives cure instantly when exposed to UV/visible radiation and can have unlimited cure through gap capability and cure in shadow area. Ideal for potting application. As a result, UV Curable CAs has provided a significant advantage over both commercially available traditional CA adhesives and conventional light-curable acrylic adhesives.

Effect of Oligomer Structure on the Properties of UV Adhesives

Willy Du, Wraio Chemicals

UV adhesives is widely used in industrial assembly, daily necessities and medical device manufacturing because of its fast curing speed, energy saving and environmental protection. The oligomer is the main component, and it has a major impact on the performance. In this paper, we have made different synthetic procedure to modify the oligomers, and carried out detailed aggregation and analysis. We tested the performance of different oligomers, and we analyzed and summarized the test results. We had a discussion on the effect of oligomer structure on the properties of UV adhesives, such as bonding strength, elongation, water resistance and cohesion etc.

Defining Sustainability with UV & EB Technology

10:15am – 11:00am

A discussion on defining sustainability with UV & EB technology.

Marci Kinter, SGIA
Todd Fayne, PepsiCo
David Biro, Sun Chemical
George Fuchs, NAPIM

Moderator: Dave Savastano, Ink World Magazine

IUVA Young Professionals Ask Me Anything (Presented by IUVA)

11:15am – 12:00pm

Panelists:

  • Kati Bell, Brown & Caldwell
  • Jim Bolton, Bolton Photosciences Inc.
  • Jennifer Pagan, AquiSense Technologies
  • Moderators: IUVA Young Professionals Group

Solvent-Free Radical Photopolymerization with Dark Curing

Kangmin Kim, University of Colorado Boulder

In radical-mediated photopolymerization, continuous irradiation is required to reach full conversion. To shift such paradigm, we developed photoinitiators that allow not only polymerization concurrent with irradiation but also continuous dark polymerization post-irradiation. For example, we intentionally shuttered the irradiation when a resin with our photoinitiator reached 20% conversion. With the dark-curing mechanism, the conversion after 60 mins reached 80% conversion, while the control type II PI remained at 20%.

Real time measurement of cure in inkjet inks

Martin Thompson, Domino Printing

We report on the development of an ultrafast version of the Lambient LFT631 dielectric cure monitor. Data points may be obtained 10x faster than is achievable with earlier instruments, or indeed by the well-known FTIR, rheological and DSC approaches. The sensors are sufficiently small that they can be mounted on a lab transport system that mimics the action of the press. Results at realistic printing speed (50m/min) will be presented.

How monomer chemistry and radical formation impact EB polymer development

Sage Schissel, PCT Ebeam and Integration, LLC

Radical reactions facilitate polymer development during EB polymerization. To better understand the kinetics of EB polymerization, primary radicals were quantified for pairs of acrylate and methacrylate monomers. Monomer chemistry was shown to impact primary radical formation; however, increased primary radical concentration did not necessarily correlate to increased polymer development.

Study of UV-Curing Behavior by Differential Scanning Calorimetry (DSC) and In-situ Dielectric Analysis (DEA)

Yanxi Zhang, NETZSCH INSTRUMENTS NORTH AMERICA, LLC

Ultraviolet (UV) light-curing is a technique being applied increasingly in the fields of coatings, paints, inks, adhesives, etc. The main advantage of light-curing systems are their fast reaction time and environment-friendly because monomer solutions are mostly free of solvents. DSC and DEA with the extension of a UV light source are powerful tools to study UV-initiated cure behavior and optimize the cure process by measuring heat released and changes in dielectric property, respectively.