Conference Program

Wednesday, March 11, 2020

Break + Exhibits

10:00 AM – 10:15 AM

Lunch + Exhibits

12:15 PM – 1:15 PM

6935 Wisconsin Ave. Ste 207 · Chevy Chase, MD 20815 · 240-497-1242 · 240-643-0517

Mechanical Endurance Testing for UV/EB Components in Flexible Electronics

Eisuke Tsuyuzaki, Endurance Testing Systems

New form factors in components and products are being introduced, including flexible hybrid electronics. Product examples are foldable displays, wearable sensors and smart IoT speakers with AI. Component examples are flexible displays, printed flexible electronics, and metal ink compounds. New material components will be needed for flexible electronics in wellness and medical products, and sportswear. New methods will be needed to design continuous and lasting mechanical performance into product designs and to test those new products.

Development of photosensitive dielectric material with high resolution and reliability

Hwa-il Jin, Samsung Electronics

Fan-out WLP is the technology that increases the number of interconnection by pulling the terminals out of the die. This technology enables wafer-level packages at a low cost even for high-performance chips. The insulating material that serves to protect Cu-line is known as playing the most important role in RDL process of Fan-out technology. In this paper, the properties of the newly designed photosensitive dielectric material with high resolution and reliability will be discussed.

Dielectric Performance for Electronic Applications using UV-Curable Chemistries

Neal T. Pfeiffenberger, Sartomer

UV-curable electronic materials require a unique set of expertise in resin formulation, processing, and end-use properties. Commercial uses for UV-curable electronic products include conformal coatings, potting, photoresists, display materials, adhesives, as well as various 3D printing applications. This paper will focus on using dielectric testing techniques to quantify a wide range of electronics resins for these growing applications.

Industrial Applications via Novel Compact Electron Beam Accelerator

Charlie Cooper, llinois Accelerator Research Center, Fermi National Accelerator Laboratory

Electron beams (e-beams) are an exceptional source of energy that can initiate chemical reactions without the need for catalysts, high temperature or high pressure. The high kinetic energy and penetrating nature of the electrons can provide significant benefits over typical chemical modification methods. E-beam accelerator sales eclipse $2B annually and provide added value to products of more than $500B every year (RW Hamm, Industrial Accelerators and Their Applications, 2012). However, adoption of e-beam technology in new areas has been relatively slow because of a general lack of knowledge of the technology. Also, conventional high energy e-beam accelerators that are available on the market have limitations in that they are not energy efficient, take up a large foot print and can be complicated to use and maintain. Fermilab, as a national leader in research and development of e-beam technology, is incorporating multiple new technologies into a novel platform e-beam accelerator that is decades more advanced than currently available technology. Concurrently, we are developing applications that would be enabled by this accelerator. Fermilab is using newly developed superconducting materials and radio frequency power supplies that can double the operating efficiency and greatly reduce the operating cost of using e-beam technology. In addition, Fermilab is using cryocoolers to cool the e-beam tool instead of flowing liquid helium which requires a cryoplant to operate. Because of these and several other advances, Fermilab aims to provide a portable accelerator that can fit on the bed of a truck, treat more product, and operate 30% more efficiently than conventional electron beam accelerators. The accelerator Fermilab is developing is pictured above. The left image represents the accelerator vacuum vessel in blue and its supporting components (a chiller, power supply and controls rack). The overall size of the skid shown is roughly 5 by 7 by 13 feet. The right image shows a cross-sectional view of the blue accelerating unit shown in the left image.

Excimer - The Latest Advances

Chris Davis, IST AMERICA

The excimer platform (@172 nm) has been developed to include surface modification/treatment, post-curing of technical coatings and applying a matt effect.Excimer easily combines with LED and UV in one platform, to provide a hybrid solution to several industrial applications. This presentation will highlight the latest advances and addresses some of the application challenges

UV Lamp Selection - A Study in Packaging Applications

Mike J Idacavage, Radical Curing LLC

Many applications with existing equipment have limited space for the addition of UV lamps. Printing on flat metal sheets for the can industry is one such application. Printing presses have a tight space constraint in which to mount an inter-deck lamp and as a result, can limit UV lamp options. Microwave lamps are seldom used because they are simply too large. However, after the sheet is printed, UV lamps can be used to complete the curing at the end of the line. In this case, any lamp size or type could be used to complete the ink cure.

This paper will explore a comparison of lamp types used for inter-deck ink curing and final ink curing. In a broader sense, the experimental results presented will be applicable to a wide range of applications where there are options to choose between high powered arc lamp, microwave lamp, or UV-LED lamp systems.

350°C high temperature SiC UV photodiode

Tilman Weiss, sglux GmbH

A new 350°C high temperature stable SiC UV Photodiode is available. Standard SiC UV photodiodes can be operated at temperatures up to 170°C. This limit is high enough for most industrial applications. However, uses like UV curing control may exceed the operating temperature limit of 170°C. The new 350°C enabled series uses a mineral sintering process for chip attachment to avoid organic adhesive decomposition under extreme conditions of use.

Responsible Care Considerations for Sustainable Development in Radiation Cure Markets

Brett Van Horn, Sartomer Americas

Sustainable development requires more than just keeping up with the fast changing pace of regulations but a comprehensive approach to innovation with respect to corporate social responsibility. This presentation will provide corporate social responsibility considerations for sustainable product development in radiation cure markets, including considerations for regulatory changes, responsible product stewardship, environmental care, and circular economies.

Regulatory Landscape for UV/EB Printing Inks in Europe

Brigitte Lindner, RAHN USA Corp.

Supplying UV/EB curable formulations from North America into other regions requires the North American based formulators to become familiar with the respective regulations for import and applications their products should be supplied into. The presentation will focus on the import into the European market regulated by EU REACH (Brexit?) and on requirements for printing inks used in food packaging applications. A short outlook on regulatory developments in other regions will be given as well.

Disilyl alpha hydroxy ketones: a novel class of photoinitiators

Marika Morone, IGM Resins

Dynamic and continued growth of the UV curing industry is dependent to the support that technical innovation can give in overcoming new challenges, such as outflanking regulatory issues and in providing substances which are safer in use and provide performance benefits. In this paper, we will present a novel silicon-based class of photoinitiators, together with applications data and a proposed photolysis mechanism. These photoinitiators offer a possible longer-term alternative to the threatened class of alpha amino ketone photoinitiators.

Quantum PIs, novel materials for water-based and solvent-free polymerization

Nir Waiskopf, The Hebrew University of Jerusalem

Quantum Photoinitiators (PIs), made of semiconductor nanocrystals, have been found as novel photoinitiators for water-based photo-curing applications, filling unmet needs and offering significant advantages over current PI technology. Herein, we will present the expansion of these unique capabilities also for solvent-free and additive-free photo-polymerization operating under modern UV-blue-LED light sources.

Photoinitiator Effect on Depth of Cure in Visible Light Cure Polymerization

Shuhua Jin, Henkel Corporation

The choice of photoinitiator (PI) is an important factor in the polymerization characteristics of light cure materials. This study investigated the influence of PI type and concentration on the surface tackiness and depth of cure (DOC) of experimental light cure acrylate formulations with several UV/visible photoinitiators. The chosen UV/visible photoinitiators include Type I PI phosphine oxide derivatives and Type II PI thioxanthone derivatives. Surface tackiness and DOC were also studied using two different radiation intensities emitted by LED 375nm and LED 405nm curing lights. The correlations of PI type and concentration with DOC help light cure material formulation to achieve a tack free surface and suitable depth of cure, which are important in many adhesive applications.

Photoinitiator selection to advance the UV curing industry in an uncertain world

Stephen R Postle, IGM Resins

The UV curing industry stands at the brink of a number of compliance and performance challenges. Photoinitiators including acyl phosphine oxides and alpha amino ketones are under activist regulatory threat. In this paper, we will present alternates to workhorse photoinitiators like TPO, novel photoinitiator blends offering dual cure options , acrylated photoinitiators for ultra-low migration, and patented acyl phosphine photoinitiators offering superior performance for sensitive packaging, ink jet, wood coatings and other sectors.

Achieving Optimal Cure Speed of Acrylic Coatings Cured in Air using UV LED Arrays

Speaker TBD, Sun Chemical, Excelitas, Wright Way UV Consulting

The relative efficiencies of three common α-cleavage photoinitiators to achieve surface cure in air of some clear acrylic hardcoat formulations sequentially exposed to a 365nm and a 278nm LED array were evaluated. The results directly correlated with the magnitude of the extinction coefficients of the photoinitiators at 278nm, thus indicating the significance of maximizing the absorbance of the photoinitiator at the air interface with the spectral emission of the shorter wavelength source to achieve optimal cure speeds in air.

Flexible Cyanoacrylate Adhesives

Ling Li, Henkel

Light-curable cyanoacrylate (CA) adhesives are one-part adhesives which can be cure by both light exposure and surface moisture. Due to this unique dual-cure mechanism, these adhesives offer significant advantage over conventional CA and light-curable acrylic adhesives. However, these adhesives cure into brittle and rigid polymers, which limits their use for bonding soft or flexible parts. In this study, several approaches to improve flexibility of cyanoacrylate adhesives are reported, and flexible cyanoacrylate adhesives were successfully developed. Products based on this innovative technology provide improved flexibility while maintain all benefits of cyanoacrylate adhesives such as fast cure speed and shadow curing capability, providing a novel solution for the assembly of flexible medical devices.

Energy Curable Structural Adhesives

Marcus Hutchins, allnex

Energy (UV) curable adhesives are single component adhesives that offer rapid cure response (bonds in seconds), high bond strength, and ease of application. UV adhesives offer unlimited pot life; they are not oxygen inhibited, have excellent resistance to a wide variety of chemicals such as fuels and solvents, and the strength to withstand some of the harshest environmental conditions. These are critical attributes for Original Equipment Manufacturing (OEM) and finishers who are consistently searching for lighter materials to improve fuel efficiency or more efficient ways to bond sensor and various parts of the vehicle body for todays or future concepts such as autonomous vehicles. Energy curable adhesives are also ideal for other applications such as structural electronics.

UV - VIS initiated unlimited cure through cyanoacrylate adhesive

Shabbir Attarwala, Henkel Corp

Cyanoacrylate (CA) monomer polymerize due to moisture and ionic cure mechanism to form an excellent adhesive bond strength on a wide variety of substrates. One of the main limitations of CAs is incomplete cure and significant decrease in adhesive properties as gap size is increased. UV curable CAs were developed using innovative UV initiator technology to overcome such limitations. These novel adhesives cure instantly when exposed to UV/visible radiation and can have unlimited cure through gap capability and cure in shadow area. Ideal for potting application. As a result, UV Curable CAs has provided a significant advantage over both commercially available traditional CA adhesives and conventional light-curable acrylic adhesives.

Effect of Oligomer Structure on the Properties of UV Adhesives

Willy Du, Wraio Chemicals

UV adhesives is widely used in industrial assembly, daily necessities and medical device manufacturing because of its fast curing speed, energy saving and environmental protection. The oligomer is the main component, and it has a major impact on the performance. In this paper, we have made different synthetic procedure to modify the oligomers, and carried out detailed aggregation and analysis. We tested the performance of different oligomers, and we analyzed and summarized the test results. We had a discussion on the effect of oligomer structure on the properties of UV adhesives, such as bonding strength, elongation, water resistance and cohesion etc.

Defining Sustainability with UV & EB Technology

10:15am - 11:00am

A discussion on defining sustainability with UV & EB technology.

Panelists Announced Soon!

Solvent-Free Radical Photopolymerization with Dark Curing

Kangmin Kim, University of Colorado Boulder

In radical-mediated photopolymerization, continuous irradiation is required to reach full conversion. To shift such paradigm, we developed photoinitiators that allow not only polymerization concurrent with irradiation but also continuous dark polymerization post-irradiation. For example, we intentionally shuttered the irradiation when a resin with our photoinitiator reached 20% conversion. With the dark-curing mechanism, the conversion after 60 mins reached 80% conversion, while the control type II PI remained at 20%.

Real time measurement of cure in inkjet inks

Martin Thompson, Domino Printing

We report on the development of an ultrafast version of the Lambient LFT631 dielectric cure monitor. Data points may be obtained 10x faster than is achievable with earlier instruments, or indeed by the well-known FTIR, rheological and DSC approaches. The sensors are sufficiently small that they can be mounted on a lab transport system that mimics the action of the press. Results at realistic printing speed (50m/min) will be presented.

How monomer chemistry and radical formation impact EB polymer development

Sage Schissel, PCT Ebeam and Integration, LLC

Radical reactions facilitate polymer development during EB polymerization. To better understand the kinetics of EB polymerization, primary radicals were quantified for pairs of acrylate and methacrylate monomers. Monomer chemistry was shown to impact primary radical formation; however, increased primary radical concentration did not necessarily correlate to increased polymer development.

Study of UV-Curing Behavior by Differential Scanning Calorimetry (DSC) and In-situ Dielectric Analysis (DEA)


Ultraviolet (UV) light-curing is a technique being applied increasingly in the fields of coatings, paints, inks, adhesives, etc. The main advantage of light-curing systems are their fast reaction time and environment-friendly because monomer solutions are mostly free of solvents. DSC and DEA with the extension of a UV light source are powerful tools to study UV-initiated cure behavior and optimize the cure process by measuring heat released and changes in dielectric property, respectively.